Plastic deformation and failure studies near a void for copper-aluminium alloy via molecular dynamics simulation

Abstract

Molecular Dynamics (MD) simulations of uniaxial as well as for biaxial tension at nano-scale was carried out for different strain rates and at different temperatures on Cu50Al50 alloy specimen having a void in order to investigate the nature of deformation as well as fracture near the void. It was seen that failure occurred in a similar manner to what is observed at macro scale i.e. by several voids formation, coalescence of void these voids into cracks leading to failure of the specimen. The engineering Stress-Strain diagram observed for the specimen showed a series of fluctuations in the stress value. The first drop in the stress can be attributed to the yielding of the material and subsequent drops could be due to formation of new voids. In most of the cases the specimen fractured by multiple necking. In case of deformation by biaxial mode no distinct trend is observed. The specimen fractured at various points unlike in case of uniaxial loading