Environmental Friendly Electroless Copper Metallization on FDM Build ABS Parts

Abstract

Environment- friendly electroless metallization of copper (Cu) on acrylonitrile-butadiene-styrene (ABS) parts was studied in which the parts are fabricated by fused deposition modelling (FDM) route of rapid prototyping (RP) process. This metallization process eliminates etching as well as the use of high cost palladium (Pd) for activation. For surface preparation aluminium (A)-enamel paste was used. Four different acidic baths were used for electroless Cu deposition and these are 15 wt% copper sulfate (CuSO4) with 5 wt% of individual hydrofluoric acid (HF), sulfuric acid (H2SO4), phosphoric acid (H3PO4), nitric acid (HNO3) and acetic acid (CH3COOH) with different deposition time at room temperature. After successfully deposition of Cu on ABS surfaces in different baths, the electroless Cu deposition on ABS surfaces were characterized by scanning electron microscopy (SEM) and energy dispersive X-ray spectrometry (EDS). Adhesion assessment of samples in different baths was studied. All baths were capable of formation of Cu crystals on ABS surface. However, better results in terms of electrical conductivity and uniformity in deposition surface is obtained in HF, H2SO4 and H3PO4 baths.