Saraf, Kunal Kumar (2011) Study of effective thermal condutivity of copper filled epoxy base composite. BTech thesis.
![[img]](/style/images/fileicons/application_pdf.png)
| PDF 2182Kb |
Abstract
Guarded heat flow meter test method is used to measure the thermal conductivity of Copper powder filled epoxy composites using an instrument UnithermTM Model 2022 in accordance with ASTM-E1530. In the numerical study, the finite-element package ANSYS is used to calculate the conductivity of the composites. Three-dimensional spheres-in-cube lattice array models are used to simulate the microstructure of composite materials for various filler concentrations. This study reveals that the incorporation of copper particulates results in enhancement of thermal conductivity of epoxy resin and thereby improves its heat transfer capability. The experimentally measured conductivity values are compared with the numerically calculated ones and it is found that the values obtained for various composite models using finite element method (FEM) are in reasonable agreement with the experimental values.
Key Words: Polymer Composite, Ceramic Powder Reinforcement, Thermal Conductivity, FEM
(
| Item Type: | Thesis (BTech) |
|---|---|
| Uncontrolled Keywords: | Polymer Composite, Ceramic Powder Reinforcement, Thermal Conductivity, FEM |
| Subjects: | Engineering and Technology > Metallurgical and Materials Science > Composites > Polymer Engineering and Technology > Mechanical Engineering > Finite Element Analysis Engineering and Technology > Civil Engineering > Materials Engineering |
| Divisions: | Engineering and Technology > Department of Mechanical Engineering |
| ID Code: | 2278 |
| Deposited By: | Saraf Kunal Kumar |
| Deposited On: | 13 May 2011 14:03 |
| Last Modified: | 13 May 2011 14:03 |
| Supervisor(s): | Satapathy, A |
Repository Staff Only: item control page
