A Study On Effective Thermal Conductivity And Dielectric Properties Of Particle Filled Epoxy Composites

Abstract

Low dielectric along with thermally conductive fillers is required for high heat output devices for electronic packaging or printed circuit board (PCB) substrate materials. Hardened neat epoxy in lieu of having good mechanical strength cannot satisfy this demand owing to very low thermal conductivity. In view of this, in the present research the dielectric as well as thermal characteristics of a new category of hybrid composite has been studied.

The present research consists of three parts: The first delineating the details of a series of epoxy resin based composite reinforced with solid glass microsphere (SGM) separately, as well as solid glass microsphere (SGM) with boron nitride (BN) ranging to different volume fraction has been fabricated using hand-lay-up technique. Second evaluate the effective thermal conductivity (keff) using finite element method (FEM), also using various other numerical thermal conductivity models available from literature survey. The last part examines the dielectric characteristic of this hybrid composite, dielectric constant measurements are done by using a HIOKI- 3532-50 Hi-Tester Elsier Analyser with an applied AC voltage of 500mv in the frequency range of 1 kHz to 1000 kHz. This study excogitates that while incorporation of SGM subdues the dielectric constant of the composite, addition of BN ameliorates the thermal conductivity.