Design of Micro-Channel Heat Sink for Wall Temperature Uniformity

Abstract

Micro-channel heats sinks are gradually replacing conventional fan heat sinks for electronic chip cooling as the heat flux removal rates required for their cooling needs are increasing day by day due to the increase in complexity and miniaturization of electronic devices. Because of higher surface to volume ratio of the micro-channels, makes them suitable to use in high heat flux removal applications. The research concentrated on this novel high heat flux removal method from last two decades. Most of the early research mostly concentrated on the optimization of geometrical parameters, flow conditions etc., to minimize the thermal resistance and pumping power. But present trends in research shifted to address the main drawback of the micro channel heat sinks i.e., wall temperature uniformity. Present research work is aimed to design a high performance heatsink for wall temperature uniformity by optimising the various parameters influencing it. All the different configurations proposed in the literature was studied carefully and based on those configurations and along with necessary modifications, performance of proposed micro channel heat sink is analysed computationally in commercially available CFD software Ansys15.0 Fluid Flow (FLUENT).